PCB design, rapid prototyping, multi-layer manufacturing...
Markets We Serve
From regulated medical environments to industrial OEM programs — our PCBs power critical applications globally.
Medical Devices
ISO 13485-aligned PCBs for diagnostics, monitoring, imaging, and therapeutic devices with full traceability.
ISO 13485 · IPC Class 3
Dental Technology
PCBs for handpieces, curing lights, endo motors, and intraoral scanners. Biocompatible and CE-certified manufacturing.
CE Mark · FDA Ready
Industrial Electronics
Rugged, high-reliability boards for PLCs, motor drives, power systems, and space-constrained industrial applications.
IPC-A-600 · Heavy Copper
OEM / ODM Partners
Co-development and full-lifecycle manufacturing partnerships for brands scaling from concept to global distribution.
NDA Protected · SLA-Backed
One Stop Solution
From early-stage design consultation to high-volume production — every service engineered for precision, speed, and compliance.
Design
DFM-focused layout engineering, multi-layer stack-up planning, signal integrity analysis, and design-for-manufacturability review before production.
Prototyping
pilot builds, iterative design cycles, and sample validation. From 1 board to 50 pieces with full engineering support.
Production
Multi-layer capability up to 32 layers. FR4, Rogers, Polyimide materials. Advanced HDI with laser-drilled microvias. ISO-controlled production line.
Assembly
SMT, through-hole, and mixed technology assembly. Pick-and-place, reflow soldering, BGA rework, and full IPC-A-610 inspection standards.
Supply Chain
BOM upload, approved vendor list management, shortage handling, global procurement coordination, and full component traceability for regulated industries.
Quality
Flying probe, bed-of-nails, AOI inspection, X-ray for BGAs, functional testing, environmental stress screening, and full traceability reports.
Capabilities
Our manufacturing capability matrix — built for engineers who need to know exactly what we can produce to spec.
Surface Finishes Available
Board Types
Standard & Advanced
The industry standard for most electronic applications. FR4-based construction with unmatched reliability for general electronics, industrial controls, telecom, and consumer devices.
Layers
1 – 32
Material
FR4 / Rogers
Thickness
0.4 – 6.0 mm
Min Trace
3 mil
Polyimide-Based
Polyimide-based circuits designed for dynamic bending, wearables, medical devices, and compact electronics requiring three-dimensional routing.
Material
Polyimide
Thickness
0.1 – 0.4 mm
Bend Radius
From 0.5 mm
Layers
1 – 6
Hybrid Technology
Combining rigid and flexible layers into a single unified board. Eliminates connectors, reduces assembly errors, and enables complex 3D shapes.
Layers
4 – 20
Flex Zone
Polyimide
Rigid Zone
FR4 / Rogers
Min Bend
0.8 mm R
High Density Interconnect
High-density interconnect boards with laser-drilled microvias, fine-pitch component support, and compact routing for smartphones and advanced medical devices.
Via Type
Laser Drill
Min Via
0.1 mm
Trace
2 / 2 mil
Structure
Any-Layer
Start Today
Join engineers and procurement teams who trust Innovalue for precision PCB manufacturing — from Cairo to the world.
